Apple today announced a redesigned thermal system for the iPhone 18 Pro and iPhone 18 Pro Max, built around a next-generation vapor chamber with three times the surface area of the iPhone 17 Pro.
The new vapor chamber continuously circulates deionized water throughout the system for significantly improved cooling performance, allowing the A20 Pro chip to maintain higher performance for longer under heavy workloads.
Apple has redesigned the silicon packaging with “custom packaging inspired by our M-series chips,” placing the silicon die and memory side-by-side rather than stacked, which removes the memory from the chip’s thermal path and allows the A20 Pro to connect directly to the vapor chamber.
According to Apple, the combination of the new packaging, new thermal materials and larger vapor chamber provides up to a 40% gain in sustained performance over the previous generation, which the company calls the highest sustained performance ever seen in an iPhone.
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